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DEVCON ALUMINIUM PUTTY F 500GR

Adhesive TypeMouldable Putty
Adhesive ColourGrey
CureRoom Temperature
Tensile Strength-
Dispensing MethodTub
Volume-
Weight500g
Product Range-
SVHC4-Nonylphenol, branched and linear (15-Jun-2015)
Adhesive ApplicationsBonding, General Purpose
Coating Coverage980cmІ
Cure Time4h
Cure Time Max16h
Cure Time Min4h
Dielectric Strength100V/m
Full Strength Cure Time16h
Fully Hardened4 hrs
MaterialAluminium-filled epoxy
Mix Ratio9
Mix Ratio by Volume4
Operating Temperature Max121°C
Resistance Temperature121°C
Shear Strength47N/mmІ
Shelf Life3Yr
Shore Hardness85
Storage Temperature Max22°C
Storage Temperature Min22°C
Temperature ResistanceDry 121 °C
Volume Specific429
Weight Min500g
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