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PCB, PHOTO RESIST, D/S, 233X160MM; Board Material:FR4 Epoxy Fibreglass; External Height:233.4mm; External Width:160mm; Board Thickness:1.6mm; SVHC:No SVHC (20-Jun-2013); Copper Coating Density:305 g/m sq; Copper Thickness:0.0356; External Depth:1.6mm; External Length / Height:233.4mm; Material:Epoxy Glass Grade FR4; No. of Holes:0; Standard:BS4584 Part 3
| Board Type | Photoresist Board |
| Board Material | Epoxy Glass Composite |
| Hole Diameter | - |
| External Height | 233.4mm |
| External Width | 160mm |
| Board Thickness | 1.6mm |
| SVHC | No SVHC (15-Jan-2018) |
| Copper Coating Density | 305 g/m sq |
| Copper Thickness | 0.0356 |
| External Depth | 1.6mm |
| External Length / Height | 233.4mm |
| Height | 233.4mm |
| Material | Epoxy Glass Grade FR4 |
| No. of Holes | 0 |
| Standard | BS4584 Part 3 |
| size_height | 233 mm |
| material | Epoxy Glass |
| rohs_status | Compliant |
| reach_svhc_compliance | No SVHC |
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