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THERMAL PAD, TO-3P; Case Style:TO-3P; Material:Boron nitride loaded silicon Elastomer; Type:Thermal Pad; External Depth:0.38mm; Thermal Resistance:0.2°C/W; Electrical Property, Ins/Con:Insulative; Temp, Op. Max:200°C; Temp, Op.
reach_svhc_compliance | No SVHC |
size_width | 19.0 mm |
rohs_status | Compliant |
material | Silicone |
lead_free_status | Lead Free |
isolation_voltage | 4.00 kV |
size_length | 25.4 mm |
size_thickness | 508 µm |
thermal_resistance | 200 mK/W |
color | White |
Insulator Body Material | Silicone Elastomer |
Thermal Conductivity | 3.5W/m.K |
Breakdown Voltage Vbr | 4kV |
Thickness | 0.508mm |
Volume Resistivity | 100000Mohm-m |
Thermal Impedance | - |
Dielectric Strength | - |
Product Range | - |
SVHC | No SVHC (15-Jan-2018) |
Electrical Property Ins / Con | Insulative |
External Depth | 0.38mm |
Isolation Voltage | 4kV |
Material | Boron nitride loaded silicon Elastomer |
Operating Temperature Max | 200°C |
Operating Temperature Min | -60°C |
Operating Temperature Range | -60°C to +200°C |
Packages Cooled | TO-220 |
Thermal Resistance | 0.2°C/W |
Type | Thermal Pad |
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