• 374724B00035G
  • 374724B00035G
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Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized

Вес0.05 кг
Количество в упаковке1
Packages CooledBGA
Thermal Resistance15.3°C/W
External Height - Imperial0.71"
External Height - Metric18mm
External Width - Imperial1.38"
External Width - Metric35mm
External Length - Imperial1.38"
External Length - Metric35mm
External Diameter - Imperial-
External Diameter - Metric-
Heat Sink MaterialAluminium
SVHCNo SVHC (17-Dec-2014)
Mounting TypeAdhesive
reach_svhc_complianceNo SVHC
size_width35.1 mm
rohs_statusCompliant
materialAluminum
lead_free_statusLead Free
mounting_styleAdhesive
packagingBox
size_length35.0 mm
thermal_resistance15.3 K/W
size_height18.0 mm
colorBlack
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