| Срок поставки и цена – по запросу | |
Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
| Вес | 0.05 кг |
| Количество в упаковке | 1 |
| Packages Cooled | BGA |
| Thermal Resistance | 15.3°C/W |
| External Height - Imperial | 0.71" |
| External Height - Metric | 18mm |
| External Width - Imperial | 1.38" |
| External Width - Metric | 35mm |
| External Length - Imperial | 1.38" |
| External Length - Metric | 35mm |
| External Diameter - Imperial | - |
| External Diameter - Metric | - |
| Heat Sink Material | Aluminium |
| SVHC | No SVHC (17-Dec-2014) |
| Mounting Type | Adhesive |
| reach_svhc_compliance | No SVHC |
| size_width | 35.1 mm |
| rohs_status | Compliant |
| material | Aluminum |
| lead_free_status | Lead Free |
| mounting_style | Adhesive |
| packaging | Box |
| size_length | 35.0 mm |
| thermal_resistance | 15.3 K/W |
| size_height | 18.0 mm |
| color | Black |
Показать остальные свойства..
