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Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized
Вес | 0.05 кг |
Количество в упаковке | 1 |
Packages Cooled | BGA |
Thermal Resistance | 15.3°C/W |
External Height - Imperial | 0.71" |
External Height - Metric | 18mm |
External Width - Imperial | 1.38" |
External Width - Metric | 35mm |
External Length - Imperial | 1.38" |
External Length - Metric | 35mm |
External Diameter - Imperial | - |
External Diameter - Metric | - |
Heat Sink Material | Aluminium |
SVHC | No SVHC (17-Dec-2014) |
Mounting Type | Adhesive |
reach_svhc_compliance | No SVHC |
size_width | 35.1 mm |
rohs_status | Compliant |
material | Aluminum |
lead_free_status | Lead Free |
mounting_style | Adhesive |
packaging | Box |
size_length | 35.0 mm |
thermal_resistance | 15.3 K/W |
size_height | 18.0 mm |
color | Black |
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