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Heat Sink; Package/Case:D2-PAK (TO-263); Thermal Resistance:15°C/W; Mounting Type:PC Board Through Hole; Length:26mm; Height:10mm; Width:15mm; Body Plating:Tin; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes ;RoHS Compliant: Yes
| Packages Cooled | TO-263 |
| Thermal Resistance | 15°C/W |
| External Height - Metric | 9.52mm |
| External Width - Metric | 25.91mm |
| External Length - Metric | 14.99mm |
| External Diameter - Metric | - |
| Heat Sink Material | Copper |
| External Height - Imperial | 0.4" |
| External Width - Imperial | 1.02" |
| External Length - Imperial | 0.59" |
| External Diameter - Imperial | - |
| Product Range | - |
| SVHC | No SVHC (17-Dec-2015) |
| reach_svhc_compliance | No SVHC |
| size_length | 26.0 mm |
| size_width | 15.0 mm |
| rohs_status | Compliant |
| material | Aluminum |
| lead_free_status | Lead Free |
| mounting_style | Through Hole, PC Board |
| packaging | Box |
| size_height | 10.0 mm |
| thermal_resistance | 15.0 K/W |
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