• AJP58
  • AJP58
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RPB PAD, PROTOBOARD, 100X580; Board Material:Resin Bonded Paper; External Height:100mm; External Width:580mm; SVHC:No SVHC (20-Jun-2011); Board Material:Resin Bonded Paper; External Length / Height:100mm; Hole Pitch:2.54mm; Material:Resin Bonded Paper; No. of Copper Coated Sides:1; PCB Hole Diameter:1mm; Pad Area:2; Pitch Spacing:2.54mm; Row Pitch:2.54mm; Type:Prototype Board

size_height100 mm
rohs_statusCompliant
materialPaper
pin_pitch2.54 mm
reach_svhc_complianceNo SVHC
Board TypeStripboard
Board MaterialTinned Copper
Hole Diameter1mm
External Height100mm
External Width580mm
Board Thickness-
SVHCNo SVHC (07-Jul-2017)
External Length / Height100mm
Height100mm
Hole Pitch2.54mm
MaterialResin Bonded Paper
No. of Copper Coated Sides1
Pad Area2
Pitch Spacing2.54mm
Row Pitch2.54mm
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