| Срок поставки и цена – по запросу |
HEAT SINK, BGA, FLIP-CHIP, 13.5°C/W; Packages Cooled:BGA; Thermal Resistance:13.5°C/W; External Height - Imperial:0.394"; External Height - Metric:10mm; External Width - Imperial:1.575"; External Width - Metric:40mm; External Length - Imperial:1.575"; External Length - Metric:40mm; Heat Sink Material:Aluminium; SVHC:No SVHC (19-Dec-2012)
| reach_svhc_compliance | No SVHC |
| rohs_status | Compliant |
| mounting_style | Adhesive |
| thermal_resistance | 13.5 K/W |
| Packages Cooled | BGA |
| Thermal Resistance | 13.5°C/W |
| External Height - Metric | 10mm |
| External Width - Metric | 40mm |
| External Length - Metric | 40mm |
| External Diameter - Metric | - |
| Heat Sink Material | Aluminium |
| External Height - Imperial | 0.394" |
| External Width - Imperial | 1.575" |
| External Length - Imperial | 1.575" |
| External Diameter - Imperial | - |
| Product Range | - |
| SVHC | No SVHC (15-Jan-2018) |
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