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SOCKET IC, SOLDERLESS, 8WAY; Connector Type:DIP; Series:D26; No. of Contacts:8; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Contact Termination:Press Fit Vertical; Contact Material:Beryllium Copper; Contact Plating:Gold; SVHC:No SVHC (20-Jun-2011); Connector Mounting Orientation:PC Board; Connector Type:DIP; Contact Clip Material:Beryllium Copper; Contact Current Max:1A; Contact Material:Beryllium Copper; Contact Plating:Gold over Nickel; Contact Resistance:10mohm; Contact Type:press fit; Current Rating:1A; Dielectric Strength VAC:1kV; External Width:10.02mm; Insulation Resistance:10000Mohm; Insulator Material:Glass filled Polyester; Lead Spacing:2.54mm; Length:10.1mm; Mounting Type:PC Board; No. of Mating Cycles:100; No. of Ways:8; Operating Temperature Max:125°C; Operating Temperature Min:-55°C; Package / Case:DIL-8; Pin Format:DIP; Shell Contact Material:Brass
number_of_contacts | 8 |
reach_svhc_compliance | No SVHC |
rohs_status | Compliant |
number_of_mating_cycles | 100 |
contact_material | Beryllium Copper |
mounting_style | Through Hole |
size_length | 10.1 mm |
contact_plating | Gold |
insulation_resistance | 10.0 GΩ |
contact_resistance | 10.0 mΩ |
current_rating | 1.00 A |
No. of Contacts | 8Contacts |
Connector Type | DIP Socket |
Pitch Spacing | 2.54mm |
Product Range | D26 Series |
Row Pitch | 7.62mm |
Contact Material | Beryllium Copper |
Contact Plating | Gold Plated Contacts |
SVHC | No SVHC (15-Jan-2018) |
Connector Mounting Orientation | PC Board |
Contact Clip Material | Beryllium Copper |
Contact Resistance | 10mohm |
Contact Termination | Press Fit Vertical |
Contact Termination Type | Press Fit |
Current Rating | 1A |
Dielectric Strength VAC | 1kV |
External Width | 10.02mm |
Insulation Resistance | 10000Mohm |
Lead Spacing | 2.54mm |
Length | 10.1mm |
No. of Mating Cycles | 100 |
Operating Temperature Max | 125°C |
Operating Temperature Min | -55°C |
Pin Format | DIP |
Shell Contact Material | Brass |