• ER2074RP250G
  • ER2074RP250G
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ENCAPSULANT, EPOXY, 250G; Potting Compound Type:Epoxy; Series:ER2074; Colour:White; Weight:250g; Conductivity:1.26 w/mk; Deflection Temperature:60deg; Dielectric Strength:10kV/mm; Max Operating Temperature:130°C; Mix Ratio:17.24:1; Mix Ratio by Volume:7.15:1; Shore Hardness:83; Useable Life:1.5hrs; Viscosity:124 poise

Potting Compound TypeEpoxy
Dispensing MethodPacket
Compound ColourWhite
Weight250g
Product Range-
SVHCNo SVHC (20-Jun-2016)
Volume-
ColourWhite
Conductivity1.26 w/mk
Deflection Temperature60deg
Dielectric Strength10kV/mm
Mix Ratio17.24
Mix Ratio by Volume7.15
Operating Temperature Max130°C
Shore Hardness83
Useable Life1.5hrs
Viscosity12.4Pa·s
Weight Min250g
colorWhite
reach_svhc_complianceNo SVHC
rohs_statusCompliant
weight250 g
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