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This device is designed specifically as a single package solution for dual switching requirements in cellular handset and other ultra-portable applications. It features two independent N-Channel MOSFETs with low on-state resistance for minimum conduction losses. The MicroFET 2x2 package offers exceptional thermal performance for its physical size and is well suited to linear mode applications.
packaging | Tape & Reel (TR) |
rohs_status | Compliant |
lead_free_status | Lead Free |
mounting_style | Surface Mount |
lifecycle_status | Active |