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HEAT SINK, BALL GRID; Packages Cooled:BGA / PLCC; Thermal Resistance:23°C/W; Width:23mm; Height:6mm; External Depth:23mm; External Height:6mm; External Length / Height:6mm; External Width:23mm; Fixing Style:Glue bond; Length:23mm; Material:Aluminium; Mounting Type:Adhesive Mount; Package / Case:BGA, PLCC-68; Surface Finish:Plain
| reach_svhc_compliance | No SVHC |
| size_height | 6.00 mm |
| material | Aluminum |
| rohs_status | Compliant |
| mounting_style | Adhesive |
| size_length | 23.0 mm |
| thermal_resistance | 23.0 K/W |
| color | Black |
| Packages Cooled | BGA, PLCC |
| Thermal Resistance | 23°C/W |
| External Height - Metric | 6mm |
| External Width - Metric | 23mm |
| External Length - Metric | 23mm |
| External Diameter - Metric | - |
| Heat Sink Material | Aluminium |
| External Height - Imperial | 0.24" |
| External Width - Imperial | 0.91" |
| External Length - Imperial | 0.91" |
| External Diameter - Imperial | - |
| Product Range | - |
| SVHC | No SVHC (15-Jan-2018) |
| Surface Finish | Plain |