• ICK BGA 23X23
  • ICK BGA 23X23
  • ICK BGA 23X23
  • ICK BGA 23X23
  • ICK BGA 23X23
  • ICK BGA 23X23
  • ICK BGA 23X23
Срок доставки – по запросу
Цена – по запросу
итого  цена по запросу

HEAT SINK, BALL GRID; Packages Cooled:BGA / PLCC; Thermal Resistance:23°C/W; Width:23mm; Height:6mm; External Depth:23mm; External Height:6mm; External Length / Height:6mm; External Width:23mm; Fixing Style:Glue bond; Length:23mm; Material:Aluminium; Mounting Type:Adhesive Mount; Package / Case:BGA, PLCC-68; Surface Finish:Plain

reach_svhc_complianceNo SVHC
size_height6.00 mm
materialAluminum
rohs_statusCompliant
mounting_styleAdhesive
size_length23.0 mm
thermal_resistance23.0 K/W
colorBlack
Packages CooledBGA, PLCC
Thermal Resistance23°C/W
External Height - Metric6mm
External Width - Metric23mm
External Length - Metric23mm
External Diameter - Metric-
Heat Sink MaterialAluminium
External Height - Imperial0.24"
External Width - Imperial0.91"
External Length - Imperial0.91"
External Diameter - Imperial-
Product Range-
SVHCNo SVHC (15-Jan-2018)
Surface FinishPlain
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