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HEAT SINK; Packages Cooled:BGA; Thermal Resistance:17K/W; External Width - Metric:31mm; External Height - Metric:10mm; Width:31mm; Length:31mm; For Use With:Processors; Height:10mm; Mounting Type:Thermally Conductive Adhesive / Foil ;RoHS Compliant: Yes
| Packages Cooled | BGA |
| Thermal Resistance | 17°C/W |
| External Height - Metric | 10mm |
| External Width - Metric | 31mm |
| External Length - Metric | 31mm |
| External Diameter - Metric | - |
| Heat Sink Material | Aluminium |
| External Height - Imperial | 0.39" |
| External Width - Imperial | 1.22" |
| External Length - Imperial | 1.22" |
| External Diameter - Imperial | - |
| Product Range | - |
| SVHC | No SVHC (15-Jan-2018) |
| For Use With | IC design BGA and others |
| reach_svhc_compliance | No SVHC |
| size_length | 31.0 mm |
| size_width | 31.0 mm |
| material | Aluminum |
| rohs_status | Compliant |
| mounting_style | Adhesive |
| size_height | 10.0 mm |
| thermal_resistance | 17.0 K/W |
| color | Black |
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