• ICKBGA27X27
  • ICKBGA27X27
  • ICKBGA27X27
  • ICKBGA27X27
Срок доставки – по запросу
Цена – по запросу
итого  цена по запросу

HEAT SINK, BALL GRID; Packages Cooled:BGA; Thermal Resistance:20°C/W; Width:27mm; Height:6mm; Length:27mm; Heat Sink Material:Aluminium; External Depth:27mm; External Height:6mm; External Length / Height:6mm; External Width:27mm; Fixing Style:Glue bond; Material:Aluminium; Mounting Type:Adhesive Mount; Package / Case:BGA; Surface Finish:Plain

reach_svhc_complianceNo SVHC
size_height6.00 mm
materialAluminum
rohs_statusCompliant
mounting_styleAdhesive
size_length27.0 mm
thermal_resistance20.0 K/W
Packages CooledBGA
Thermal Resistance20°C/W
External Height - Metric6mm
External Width - Metric27mm
External Length - Metric27mm
External Diameter - Metric-
Heat Sink MaterialAluminium
External Height - Imperial0.24"
External Width - Imperial1.06"
External Length - Imperial1.06"
External Diameter - Imperial-
Product Range-
SVHCNo SVHC (15-Jan-2018)
Surface FinishPlain
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