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ENCAPSULANT, EPOXY, THERMAL COND, 250G

Potting Compound TypeEpoxy
Dispensing MethodSachet
Compound ColourWhite
Weight250g
Product Range-
Volume-
ColourWhite
Cure Time Max24h
Cure Time Min2h
Mix Ratio13.8
Mix Ratio by Volume6.2
Operating Temperature Max80°C
Operating Temperature Min25°C
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