• RE210-S3
  • RE210-S3
  • RE210-S3
  • RE210-S3
  • RE210-S3
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итого  цена по запросу

PCB, PROTOTYPE, RE210-S3; Board Material:CEM3; External Height:100mm; External Width:580mm; Board Thickness:1.5mm; SVHC:No SVHC (20-Jun-2011); Board Material:CEM3; Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:100mm; Hole Matrix:38 x 227; Hole Pitch:2.54mm; Material:CEM3; No. of Copper Coated Sides:1; No. of Holes:8626; PCB Hole Diameter:1mm; PCB Size:100 x 580 mm; Pad Area:2.20 mm Ø; Pad Diameter:2.2mm; Pitch Spacing:2.54mm; Type:Prototype Board

pin_pitch2.54 mm
rohs_statusCompliant
reach_svhc_complianceNo SVHC
Board TypeMatrix Board
Board MaterialEpoxy Glass Composite
Hole Diameter1mm
External Height100mm
External Width580mm
Board Thickness1.5mm
SVHCNo SVHC (07-Jul-2017)
Copper Coating DensityHAL 5 - 6 µm (hole 2 - 3 µm)
Copper Thickness35µm
External Length / Height100mm
Hole Matrix38 x 227
Hole Pitch2.54mm
MaterialCEM3
No. of Copper Coated Sides1
No. of Holes8626
PCB Size100 x 580 mm
Pad Area2.20 mm Ш
Pad Diameter2.2mm
Pitch Spacing2.54mm
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