• RE230-LF
  • RE230-LF
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PCB, PROTOTYPE, RE230-LF; Board Material:FR4 Epoxy Glass; External Height:114.3mm; External Width:165.1mm; Board Thickness:1.6mm; SVHC:No SVHC (20-Jun-2011); Board Material:Epoxied FR4; Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:114.3mm; Hole Matrix:40 x 60; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:1; No. of Holes:2400; PCB Hole Diameter:1.02mm; PCB Size:114.30 x 165.10 mm (4.5 x 6.5 "); Pad Area:2.00 mm²; Pitch Spacing:2.54mm; Type:Prototype Board

Board TypeMatrix Board
Board MaterialEpoxy Glass Composite
Hole Diameter1.02mm
External Height114.3mm
External Width165.1mm
Board Thickness1.6mm
SVHCNo SVHC (07-Jul-2017)
Copper Coating DensityHAL 5 - 6 µm (hole 2 - 3 µm)
Copper Thickness35µm
External Length / Height114.3mm
Hole Matrix40 x 60
Hole Pitch2.54mm
MaterialEpoxied FR4
No. of Copper Coated Sides1
No. of Holes2400
PCB Size114.30 x 165.10 mm (4.5 x 6.5 ")
Pad Area2.00 mmІ
Pitch Spacing2.54mm
materialEpoxy Glass
pin_pitch2.54 mm
rohs_statusCompliant
reach_svhc_complianceNo SVHC
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