• RE435-LF
  • RE435-LF
  • RE435-LF
  • RE435-LF
  • RE435-LF
  • RE435-LF
  • RE435-LF
  • RE435-LF
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SMD PCB,FR4,spacing 1.27 & 2.54mm; Board Material:FR4 Epoxy Glass; Hole Diameter:0.35mm; External Height:53mm; External Width:95mm; Board Thickness:0.7mm; SVHC:No SVHC (20-Jun-2011); Board Material:FR4 Epoxy Glass; Copper Coating Density:HAL 5 - 6 µm (hole 2 - 3 µm); Copper Thickness:35µm; External Length / Height:53mm; Hole Matrix:39 x 59; Hole Pitch:1.27mm; Material:Epoxy FR4; No. of Copper Coated Sides:2; No. of Holes:2301; PCB Hole Diameter:0.35mm; PCB Size:53 x 95 mm; Pad Area:1.00 mm²; Pitch Spacing:1.27mm; Type:Prototype Board

Board TypeSMD Board
Board MaterialEpoxy Glass Composite
Hole Diameter0.35mm
External Height53mm
External Width95mm
Board Thickness0.7mm
SVHCNo SVHC (07-Jul-2017)
Copper Coating DensityHAL 5 - 6 µm (hole 2 - 3 µm)
Copper Thickness35µm
External Length / Height53mm
Hole Matrix39 x 59
Hole Pitch1.27mm
MaterialEpoxy FR4
No. of Copper Coated Sides2
No. of Holes2301
PCB Size53 x 95 mm
Pad Area1.00 mmІ
Pitch Spacing1.27mm
materialEpoxy Glass
pin_pitch1.27 mm
rohs_statusCompliant
reach_svhc_complianceNo SVHC
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