• RE900
  • RE900
  • RE900
  • RE900
Срок доставки – по запросу
Цена – по запросу
итого  цена по запросу

MULTIADAPTOR, SMD, FR4, TSOP I/II; Board Material:FR4 Epoxy Glass; External Height:72.2mm; External Width:76.2mm; Board Thickness:1.5mm; Board Connector / Footprint:TSOP 1 & TSOP 2; SVHC:No SVHC (20-Jun-2011); Board Material:Epoxied FR4; Connector Type:TSOP 1 & TSOP 2; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Length / Height:72.2mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; PCB Hole Diameter:1mm; PCB Size:72.60 x 72.20 mm; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm; Pitch Spacing:2.54mm; Type:SMT Device Adapter

Pitch Spacing2.54mm
Product Range-
SVHCNo SVHC (07-Jul-2017)
Board Connector / FootprintTSOP-1 & TSOP-2
Board MaterialEpoxy Glass Composite
Board Thickness1.5mm
Board TypeSMD Device Adapter
Copper Coating Densitychem. Au 0.08 - 0.1 µm
Copper Thickness35µm
External Height72.2mm
External Length / Height72.2mm
External Width76.2mm
Hole Diameter1mm
Hole Pitch2.54mm
MaterialEpoxied FR4
No. of Copper Coated Sides2
PCB Size72.60 x 72.20 mm
Pad Area1.50 mm Ш
Pad Diameter1.5mm
materialEpoxy Glass
pin_pitch2.54 mm
rohs_statusCompliant
reach_svhc_complianceNo SVHC
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