• RE900-04
  • RE900-04
  • RE900-04
Срок поставки и цена – по запросу

ADAPTOR, SMD, 0.65MM, 16-36PIN; Board Material:FR4 Epoxy Glass; External Height:16.5mm; External Width:43.5mm; Board Thickness:1.5mm; Board Connector / Footprint:TSOP-1, 16-36 Pin; SVHC:No SVHC (20-Jun-2011); Board Material:Epoxied FR4; Connector Type:TSOP-1, 16-36 Pin; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Length / Height:16.5mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:36; PCB Hole Diameter:1mm; PCB Size:43.5 x 16.5 mm; Pad Diameter:1.5mm; Pitch Spacing:2.54mm; Type:SMT Device Adapter

materialEpoxy Glass
pin_pitch2.54 mm
rohs_statusCompliant
reach_svhc_complianceNo SVHC
Pitch Spacing2.54mm
Product Range-
SVHCNo SVHC (07-Jul-2017)
Board Connector / FootprintTSOP-1, 16-36 Pin
Board MaterialEpoxy Glass Composite
Board Thickness1.5mm
Board TypeSMD Device Adapter
Copper Coating Densitychem. Au 0.08 - 0.1 µm
Copper Thickness35µm
External Height16.5mm
External Length / Height16.5mm
External Width43.5mm
Hole Diameter1mm
Hole Pitch2.54mm
MaterialEpoxied FR4
No. of Copper Coated Sides2
No. of Holes36
PCB Size43.5 x 16.5 mm
Pad Diameter1.5mm
Показать остальные свойства..

    Ранее просмотренные товары