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MULITADAPTOR, SMD, FR4, TSSOP; Board Material:FR4 Epoxy Glass; External Height:58.9mm; External Width:120.1mm; Board Thickness:1.5mm; Board Connector / Footprint:TSSOP; SVHC:No SVHC (20-Jun-2011); Board Material:Epoxied FR4; Connector Type:TSSOP; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Length / Height:58.9mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; PCB Hole Diameter:1mm; PCB Size:58.9 x 120.1; Pad Area:1.50 mm Ø; Pad Diameter:1.5mm; Pitch Spacing:2.54mm; Type:SMT Device Adapter
| Pitch Spacing | 2.54mm |
| Product Range | - |
| SVHC | No SVHC (07-Jul-2017) |
| Board Connector / Footprint | TSSOP |
| Board Material | Epoxy Glass Composite |
| Board Thickness | 1.5mm |
| Board Type | SMD Device Adapter |
| Copper Coating Density | chem. Au 0.08 - 0.1 µm |
| Copper Thickness | 35µm |
| External Height | 58.9mm |
| External Length / Height | 58.9mm |
| External Width | 120.1mm |
| Hole Diameter | 1mm |
| Hole Pitch | 2.54mm |
| Material | Epoxied FR4 |
| No. of Copper Coated Sides | 2 |
| PCB Size | 58.9 x 120.1 |
| Pad Area | 1.50 mm Ш |
| Pad Diameter | 1.5mm |
| material | Epoxy Glass |
| pin_pitch | 2.54 mm |
| rohs_status | Compliant |
| reach_svhc_compliance | No SVHC |