• RE933-07
  • RE933-07
  • RE933-07
  • RE933-07
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ADAPTOR, SMD, TSSOP-32, 0.65MM; Board Material:FR4 Epoxy Glass; External Height:23.5mm; External Width:25.5mm; Board Thickness:1.5mm; Board Connector / Footprint:TSSOP-32; SVHC:No SVHC (20-Jun-2011); Board Material:Epoxied FR4; Connector Type:TSSOP-32; Copper Coating Density:chem. Au 0.08 - 0.1 µm; Copper Thickness:35µm; External Length / Height:23.5mm; Hole Pitch:2.54mm; Material:Epoxied FR4; No. of Copper Coated Sides:2; No. of Holes:32; PCB Hole Diameter:1mm; PCB Size:23.5 x 25.5 mm; Pad Diameter:1.5mm; Pitch Spacing:2.54mm; Type:SMT Device Adapter

materialEpoxy Glass
pin_pitch2.54 mm
rohs_statusCompliant
reach_svhc_complianceNo SVHC
Pitch Spacing2.54mm
Product Range-
SVHCNo SVHC (07-Jul-2017)
Board Connector / FootprintTSSOP-32
Board MaterialEpoxy Glass Composite
Board Thickness1.5mm
Board TypeSMD Device Adapter
Copper Coating Densitychem. Au 0.08 - 0.1 µm
Copper Thickness35µm
External Height23.5mm
External Length / Height23.5mm
External Width25.5mm
Hole Diameter1mm
Hole Pitch2.54mm
MaterialEpoxied FR4
No. of Copper Coated Sides2
No. of Holes32
PCB Size23.5 x 25.5 mm
Pad Diameter1.5mm
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