• WLK30
  • WLK30
  • WLK30
  • WLK30
  • WLK30
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Цена – по запросу
итого  цена по запросу

ADHESIVE, THERMAL CONDUCTIVE; Adhesive Type:Epoxy - 2 Part; Series:WLK; Adhesive Applications:Bonding - Thermal Heat Sink; Dispensing Method:Bottle; Weight:30g; Material:Epoxyd; Max Operating Temperature:149°C; Min Temperature Operating:-56°C; Temperature Resistance:120 °Ccm/W; Thermal Conductivity (W/m.K):0.836W/m.K; Min Weight:30g

reach_svhc_complianceNo SVHC
rohs_statusCompliant
weight30.0 g
Adhesive TypeActivator / Hardener
Adhesive Colour-
Thermal Conductivity0.836W/m.K
Tensile Strength-
Dispensing MethodBottle
Volume-
Weight30g
Product Range-
SVHCNo SVHC (15-Jan-2018)
Adhesive ApplicationsBonding, Thermal Heat Sink
MaterialEpoxyd
Operating Temperature Max149°C
Operating Temperature Min-56°C
Temperature Resistance120 °Ccm/W
Weight Min30g
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