Срок доставки – по запросу | Цена – по запросу |
ADHESIVE, THERMAL CONDUCTIVE; Adhesive Type:Epoxy - 2 Part; Series:WLK; Adhesive Applications:Bonding - Thermal Heat Sink; Dispensing Method:Bottle; Weight:30g; Material:Epoxyd; Max Operating Temperature:149°C; Min Temperature Operating:-56°C; Temperature Resistance:120 °Ccm/W; Thermal Conductivity (W/m.K):0.836W/m.K; Min Weight:30g
| reach_svhc_compliance | No SVHC |
| rohs_status | Compliant |
| weight | 30.0 g |
| Adhesive Type | Activator / Hardener |
| Adhesive Colour | - |
| Thermal Conductivity | 0.836W/m.K |
| Tensile Strength | - |
| Dispensing Method | Bottle |
| Volume | - |
| Weight | 30g |
| Product Range | - |
| SVHC | No SVHC (15-Jan-2018) |
| Adhesive Applications | Bonding, Thermal Heat Sink |
| Material | Epoxyd |
| Operating Temperature Max | 149°C |
| Operating Temperature Min | -56°C |
| Temperature Resistance | 120 °Ccm/W |
| Weight Min | 30g |